Technical Papers and Presentations

Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

A Study of Lubricating Flows in MEMS Bearings

E. Gutierrez-Miravete[1], and J. Streeter[2]

[1]Department of Engineering and Science, Rensselaer at Hartford, Hartford, Connecticut, USA
[2]Optiwind, Torrington, Connecticut, USA

The bearing and shaft are part of a safe and arm device constructed as an assembly by a multi-layer additive/subtractive plating and planarization processes (EFAB technology). Devices are constructed by a multi-layer additive/subtractive planarization process. This paper evaluates the lubricating flow between the shaft and journal of the MEMS bearing for seven configurations. The pressure ...

Simulation of Highly Nonlinear Electrokinetics Using a Weak Formulation

G. Soni[1], T. Squires[2], and C. Meinhart[1]

[1]Department of Mechanical Engineering, University of California Santa Barbara, CA, USA
[2] Department of Chemical Engineering, University of California Santa Barbara, CA, USA

We present a numerical model for simulating highly nonlinear electrokinetic phenomena, which occurs at high zeta potentials. In this model, the electric double layer is realized by solving a partial differential equation (PDE) on the double-layer-inducing surface. We also allow for a nonlinear surface capacitance, which relates the surface charge density to the zeta potential of the surface. With ...

Modeling and Characterization of Superconducting MEMS for Microwave Applications in Radioastronomy

N. Al Cheikh[1], P. Xavier[1], J. Duchamp[1], and K. Schuster[2]
[1]Institute of Microelectronics, Electromagnetism and Photonics (IMEP-LAHC), Grenoble, France
[2]Institute of Millimetrics Radio Astronomy (IRAM), Grenoble, France

Superconducting GHz electronics circuits are frequently used in Radio Astronomy instrumentation. The features of these instrumentations can be significantly improved by using tuneable capacitances, which can be realized by electrically actuated, micromechanical bridges (MEMS) made of superconducting Niobium (Nb). In order to analyze the electromechanical behavior of such devices and the intrinsic ...

Effect of Mass Adsorption on a Resonant NEMS

J. J. Ruz Martinez
Instituto de Microelectronica de Madrid
Tres Cantos
Madrid, Spain

The motion of a resonant NEMS has been widely studied for many different applications such as structural mechanics in engineering, ultra sensitive mass spectrometers or the well known Atomic Force Microscope. The study of the eigenfrequencies of such structures is very important, and nowadays there are good theoretical methods to accurately predict such eigenfrequencies. When a little mass is ...

Quartz Transducer Modeling for Development of BAW Resonators

L.B.M. Silva[1], E.J.P. Santos[1]
[1]Laboratory for Devices and Nanostructures, Electronics and Systems Department, Universidade Federal de Pernambuco, Recife, PE, Brasil

Transducer optimization is a key aspect for successful development and deployment of advanced sensors, especially when designing 3D structures for harsh environments. For piezoelectric transducers, plate thickness determines the operating frequency of the resonator, which is frequently tuned in the shear thickness vibration mode. Quartz has been the material of choice for the fabrication of bulk ...

Void Shape Evolution of Silicon Simulation in COMSOL Multiphysics®

C. Grau Turuelo[1], B. Bergmann[1], C. Breitkopf[1]
[1]Technische Universität Dresden, Dresden, Germany

The void shape evolution of a trench patterned silicon substrate results in diverse cavities by varying initial conditions. The size and the arrangement of the initial trenches are decisive for the transformation process besides the annealing conditions which are, in fact, time and temperature, and the existing pressure values. The prediction of the shape evolution depending on different ...

Simulation of Cellular Traction Force Based Deflection of PDMS Micropillars - new

J. Wala[1], D. Maji[1], S. Dhara[1], S. Das[1]
[1]Indian Institute of Technology Kharagpur, Kharagpur, West Bengal, India

Cells are complex entities which not only passively sense external stimuli (viz. chemical, optical or mechanical) but also interact with extracellular matrix (ECM) by regulating cellular behavior such as growth, proliferation, migration, etc. Monitoring cell growth and migration of adherent cells becomes a crucial factor in determining cell-cell and cell-substrate interaction, important for ...

Simulation of Topology Optimized Electrothermal Microgrippers

O. Sardan[1], D. Petersen[1], O. Sigmund[2], and P. Boggild[1]
[1]DTU Nanotech, Denmark
[2]DTU Mechanical Engineering, Denmark

In this work, electrothermal microgrippers designed using topology optimization are modeled. The microgrippers are composed of two 5 μm-thick polysilicon actuators facing each other. The gap between the actuators are 2 μm in the initial state and the microgrippers are able to both fully close and further open this gap. The operation principle of the actuators is quite similar to that of a ...

Multiphysics System Simulation for MEMS Inertial Sensors

R. Sattler
University of Applied Sciences, Regensburg, Germany

This paper gives an overview of modelling microsensors on geometry and system level. The focus will be on the generation of the multiphysics reduced order system model and the coupling with package and ASIC models. The method is based on modal superposition. This means all the details of the sensor can be considered in a finite element model. The mechanical mode shapes of this model form the ...

Multi-Domain Analysis of Silicon Structures for MEMS Based-Sensors

N. Bhalla[1], S. Li[2], and D. Chung[1]
[1]Chung Yuan Christian University, Chungli,Taiwan
[2]National Tsing Hua University, Hsinchu, Taiwan

Investigation in this paper aims at performing Mechanical Stress Strain analysis, Thermal, Piezoresistive and Piezoeletric analysis of Silicon Structures using COMSOL. The simulation results have been cross checked by mathematical calculation.

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