Technical Papers and Presentations

Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

Powerful automation and optimization methods for Material- and Process analysis with COMSOL Multiphysics and Matlab

T. Frommelt
SGL Group, Technology & Innovation, Meitingen, Germany

Thomas Frommelt received his PhD in physics in 2007 from the University of Augsburg for experimental work and simulation analysis on acoustically driven microfluidic mixing. In 2008, he joined the SGL Group and introduced COMSOL Multiphysics as the tool for flexible equation based modelling. Since then, he has focused on carbon material and process simulation employing methods of optimization and ...

Xylophone Bar Magnetometry and Inertial-grade MEMS Optimisation: a Multiphysics Approach

H. T. D. Grigg, and B. J. Gallacher
Microsystems Group
Newcastle University
Newcastle upon Tyne
Tyne and Wear, UK

This paper presents ongoing research aimed at development of a MEMS magnetometer capable of nanoTesla sensitivity. Such a device would pave the way for inertial-grade MEMS IMUs. A resonant sensor is proposed, based on a Xylophone Bar sense element, and is analysed both directly and via COMSOL. Mode shapes and frequencies are found as functions of geometric parameters, and the results used ...

Positioning System for Particles in Microfluidic Structures

D. Kappe[1], A. Hütten[1]
[1]University of Bielefeld, Bielefeld, Germany

The possibility to detect and probe molecules in microfluidic devices gives rise to interesting applications. There are different approaches how to detect and probe particles, but a common step, for most methods, is to place the particles on a sensor. This can be done by applying external field gradients, or in this case by utilizing gravitational and hydrodynamic effects. Therefore, the sensor ...

Electromagnetic Release Process for Flexible Electronics

G. Coryell[1][,][2]
[1]School for Engineering of Matter, Transport, and Energy, Arizona State University, Tempe, AZ, USA
[2]Chemistry Department, United States Naval Academy, Annapolis, MD, USA

Flexible electronics are temporarily affixed to a rigid carrier such as glass or silicon prior to device fabrication to facilitate robotic handling of the device, but also to allow optical lithography to stay within overlay design registration budget; without the rigid carrier, a freestanding flexible substrate such as polyimide would distort unacceptably during even minor temperature excursions ...

Design and Analysis of MEMS Micro Mirror using Electro Thermal Actuators

L. Sujatha[1], D. K. Balasubramanian[2], V. S. Selvakumar[1]
[1]Rajalakshmi Engineering College, Chennai, India
[2]University of Central Florida, Orlando, Florida, United States

Micro Mirror is a versatile device which has been gaining popularity and also the importance of MEMS techniques to develop such devices. These mirrors find applications in fields such as optical switching, display and in medical fields for non-invasive imaging. A thermally actuated mirror moves in either vertical or horizontal directions for the given orientation. The ends of thermal actuators ...

Study of Fluid Dynamics and Heat Transfer in MEMS Structures

S. N. Das[1], G. Bose[2]
[1]Centurion University of Technology and Managment, Jatani, Bhubaneswar, Orissa, India
[2]Institute of Technical Education and Research, SOA University, Bhubaneswar, Orissa, India

This paper describes the characteristics of MEMS microchannel and various issues of its designing. Here the major parameters are pressure drop and heat transfer rate. Various structures are modeled and optimized to get a minimum pressure drop and maximum heat transfer rate. The simulation results provide the characterization for Temperature, Mass flow rate, Pressure drop and Reynolds number. Here ...

Thermomechanical Effects of the Packaging Molding Process on the Chip in Integrated Circuits

N. Semmar[1], M. Fournier[1], P. S. Alleaume [2], A. Seigneurin [3], , ,
[1]GREMI-UMR7344, CNRS/University of Orléans, Orléans, France
[2]Collegium Sciences et Techniques, Orléans, France
[3]ST Microelectronics Tours SAS, Tours, France

Usually, in integrated circuits, the chip is brazed on leadframe and then, a polymer resin is molded around to create the packaging. On the first hand, the molding process at high temperatures will induce thermomechanical stress on the chip. As the leadframe, the chip and the braze have all different thermoelastic properties, these stress can be critical for the chip connections. To ...

Three-Dimensional Percolation Properties Simulation of a Marine Coating Based on Its Real Structure Obtained from Ptychographic X-Ray Tomography

B. Chen[1], M. Guizar-Sicairos[2], G. Xiong[1], L. Shemilt[1], A. Diaz[2], J. Nutter[1], N. Burdet[1], S. Huo[1], F. Vergeer[3], A. Burgess[4], I. Robinson[1]
[1]London Centre for Nanotechnology, University College London, London, UK
[2]Paul Scherrer Institute, Villigen, Switzerland
[3]AkzoNobel Co. Ltd., Sassenheim, Netherlands
[4]AkzoNobel (UK) Co. Ltd., Tyne and Wear, UK

We present quantitative nano-scale analysis of the 3D spatial structure of an anticorrosive aluminium epoxy barrier marine coating obtained by ptychographic X-ray computed tomography (PXCT) [1-3]. We then use COMSOL Multiphysics® software to perform simulations on the acquired real 3D structure to demonstrate how percolation through this actual 3D structure impedes ion diffusion in the ...

Finite Element Analysis of Temperature and Viscosity Effects on Resonances in Thin-Film Bulk Acoustic Wave Resonators

G. Rughoobur[1], M. DeMiguel-Ramos[2], L. García-Gancedo[1], M. Clement[2], J. Olivares[2], T. Mirea[2], W. I. Milne[1], E. Iborra[2], A. J. Flewitt[1]
[1]University of Cambridge, Cambridge, UK
[2]Universidad Politécnica de Madrid, Madrid, Spain

The shear mode of film bulk acoustic resonators (FBARs) is preferred to the longitudinal mode owing to its lower acoustic losses in a liquid. However in addition to mass loading, the resonance is also affected by temperature and liquid viscosity. These two parameters can either be sensed or compensated using a layer of silicon dioxide, which has a unique temperature coefficient of elasticity. In ...

MEMS Pirani Sensor for Pressure Measurements in the Fine- and High-Vacuum Range

M. Grau[1], F. Völklein[1], A. Meier[1], C. Kunz[1], P. Woias[2]
[1]RheinMain University of Applied Sciences, Institute for Microtechnologies, Rüsselsheim, Germany
[2]University of Freiburg, Department of Microsystems Engineering, Freiburg, Germany

A high performance MEMS Pirani sensor (VAC_03) was designed and optimized based on analytics. Due to the fact that this MEMS Pirani sensor is a 3D-Object, the calculation of the thermal radiation by analytics is limited. As the radiation behavior in the system is, beside the solid thermal conductance, responsible for the low-pressure detection limit of such vacuum gauges, we switched to a ...

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