Numerical and Experimental Analysis of Natural and Mixed Convection Heat Transfer for Vertically Arranged DIMM
G. Petrone, and G. Cammarata
University of Catania, Catania, Italy
It is commonly recognized that careful thermal design of electronic equipments represents an unavoidable pre-production step in order to ensure reliability and performance of those components during their functioning. This paper mainly concerns a comparison between experimental and numerical results obtained in studying thermal dissipation in natural and mixed convection conditions for RAM ...
C. Romao, and M. White
Dept. of Chemistry and Institute for Research in Materials
A series of 2-D finite element models of a ZrO2-ZrW2O8 composite system were created in COMSOL Multiphysics to study the effect of pores between the matrix (ZrO2) and filler (ZrW2O8) materials. Pores were modeled as ellipses concentric with the filler particles. Seventeen model geometries of varying microstructure were studied in order to determine correlations between microstructural factors ...
K. PraveenKumar, P. Suresh, K. Subash, M. Alagappan, A. Gupta
PSG College of Technology, Coimbatore, Tamil Nadu, India.
In this work, we present the performance analysis of novel micro machined Piezoresistive fluid flow pressure sensor using COMSOL Multiphysics. The principle of the sensing mechanism is based on the deflection of four sensing layers embedded on a thin membrane. The fluid passes through the layer causes the deflection of the sensing layer which measures the pressure of the fluid. The following ...
L. Verbruggen1, J. Kotiniitty2, and M. Lehtonen1
1Power Systems and High Voltage Laboratory, Helsinki University of Technology, Helsinki, Finland
2Nokian Capacitors Ltd., Tampere, Finland
A crucial factor concerning modern reactors is a combination of laws and electro-technical rules defining appropriate produced sound levels. Currently, it is an important issue to reduce noise in order to fulfill all sound requirements. Noise results from reactor vibrations due to sinusoidal currents flowing through the reactor. The flowing currents induce electromagnetic fields which generate ...
R. Malek-Madani, and J.J. Radice
US Naval Academy, Annapolis, MD, USA
The study of deformation of an adhesively bonded sandwich structure reduces to solving the biharmonic equation for the Airy Stress subject to mixed boundary conditions. Because of the nature of the boundary conditions, this boundary value problem does not yield to the standard elementary methods and must be attacked by numerical methods. In this paper we will use COMSOL\'s capability in two ways ...
D. Remaoun, and A. Boutaous
Département de Physique, Université des Sciences et de la Technologie, Oran, Algérie
The present work aims to describe the behavior of the interface using the method of load transfer between fiber and matrix in a composite material. Our contribution was first to simulate the mechanical behavior of a composite, for a given radius of the fiber was able to automate the result for different rays thus different proportions of the reinforcement, the simulation was done with software ...
CARCO, Basiano, Milano, Italy
Simulations of more than one type of seal have been done where the deformation and the stress of the seal itself or the pressure on the housing are of interest. According to the deformation of the seal we can modify the housing of the seal or its geometry depending on the design constraints to meet. Stresses on the seal are indicators of which changes have to be implemented on the geometry so to ...
Y.F. Wang, Y.S. Wang, L. Wang
Institute of Engineering Mechanics, Beijing Jiaotong University, Beijing, China
Department of Mechanical Engineering, Østfold University College, Halden, Norway
We show in this paper that by careful design of the geometry of the resonators, complete bandgap with relatively low center frequency can be obtained for 2D and 3D Phononic Crystals with resonators. The generation of the bandgap is due to the local resonance of the unit cell. Spring-mass and spring-pendulum models are developed to predict the boundaries of the complete bandgap. The predicted ...
Evaluation of Low-Cycle-Fatigue Life of Solder Joints in Surface Mounting Power Devices by Finite Element Modeling
N. Delmonte, F. Giuliani, M. Bernardoni, P. Cova
Dipartimento di Ingegneria dell'Informazione, Università degli Studi di Parma, Parma, Italy
CDTR - Centre for Device Thermography and Reliability, H. H. Wills Dept. of Physics, University of Bristol, Bristol, United Kingdom
The reliability of solder joints [1,2] is one of the key factors in the determination of the reliability of the high power density electronic converters, being the solder joints both the mechanical, the electrical, and often the thermal connections between the electronic component and the board in which the component is placed. The main mechanism by which solder joints are damaged is thermal ...
J. Wirth, S. Jack, M. Köhl, and K.-A. Weiß
Fraunhofer Institute for Solar Energy Systems ISE, Freiburg, Germany
The key issues of the Fraunhofer Institute for Solar Energy Systems are research and development of solar technologies for the fast growing market of solar energy. This paper presents examples of the usage of COMSOL Multiphysics: The ingress of water is a serious reason for the degradation of photovoltaic modules which can hardly be measured using experimental approaches yet. Therefore, a ...