Stress analysis of an IGBT module under the Highly Accelerated Stress Test (HAST) condition
Application ID: 124191
The Highly Accelerated Stress Test (HAST) is a testing technique to precipitate failure of electronic devices under elevated temperature and high humidity environment. This model demonstrates the structural analysis of a plastic encapsulated IGBT module under the HAST testing condition. The thermal stress and the hygroscopic swelling, as well as the moisture transport are investigated.
The test condition is based on the Standard JESD22-A110
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