Technical Papers and Presentations

Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

Simulation of Highly Nonlinear Electrokinetics Using a Weak Formulation

G. Soni[1], T. Squires[2], and C. Meinhart[1]

[1]Department of Mechanical Engineering, University of California Santa Barbara, CA, USA
[2] Department of Chemical Engineering, University of California Santa Barbara, CA, USA

We present a numerical model for simulating highly nonlinear electrokinetic phenomena, which occurs at high zeta potentials. In this model, the electric double layer is realized by solving a partial differential equation (PDE) on the double-layer-inducing surface. We also allow for a nonlinear surface capacitance, which relates the surface charge density to the zeta potential of the surface. With ...

An Analysis of Plunger Temperature during Glass Parison Pressing

P. Ngankeu[1], and E. Gutierrez-Miravete[2]

[1]EMHART Glass Research Inc, Windsor, CT, USA
[2]Rensselaer at Hartford, Hartford, CT, USA

The press and blow (P&B) process is widely used to produce glass containers. While the P&B process has demonstrated to be capable of reducing container weight by as much as 33%, it can also induce the formation of micro-checks that weaken container strength. This paper presents a model of the heat transfer due to the intermittent contact of glass with the plunger during several pressing ...

Towards the Modeling of Microgalvanic Corrosion in Aluminum Alloys: the Choice of Boundary Conditions

N. Murer[1], N. Missert[2], and R. Bucchheit[1]

[1]Fontana Corrosion Center, Ohio State University, Columbus, OH, USA
[2]Sandia National Laboratories, Albuquerque, NM, USA

Aluminum alloys in near-neutral, mildly aggressive solutions, undergo damage accumulation during corrosion, mostly due to the presence of micrometer-sized constituent intermetallic particles (IMP) that create a microstructural discontinuity at which localized corrosion occurs. The Nernst-Planck equation with electroneutrality is used to simulate current and pH distributions resulting from ...

Modelling the Thermal Impact of a Repository for High-Level Radioactive Waste in a Clay Host Formation

X. Sillen
Belgian Nuclear Research Centre (SCK-CEN), Waste & Disposal Department, Mol, Belgium

Disposal in deep clay geological formations is one of the promising options for disposal of high-level radioactive waste. Yet, they can generate considerable amounts of heat as a side effect of radioactive decay. This paper shows how COMSOL Multiphysics has been used to evaluate the physical impacts of the heating on the geological media around a deep disposal system. The software was found ...

Simulation of the Destruction Effects in CMOS-Devices caused by Impact of Fast Transient Electromagnetic Pulses

M. Rohe, S. Korte, and M. Koch
Institute for the Basics of Electrical Engineering and Measurement Science, Leibniz Universität Hannover, Germany

In this paper will be presented how an electronic system and its components will respond in case of an impact of an external electromagnetic pulse (EMP). In the first instance the coupling process of transient electromagnetic pulses into electronic systems will be shown. Out of that the disturbing signal inside the system, which is necessary for the following simulation, will be described ...

Image Based-Mesh Generation for Realistic Simulation of theTranscranial Current Stimulation

R. Said[1], R. Cotton[1], P. Young[1], A. Datta[2], M. Elwassif[2] , and M. Bikson[2]
[1] Simpleware Ltd, Exeter, Devon, UK
[2] Department of Biomedical Eng., The City College of New York, New York, NY, USA

This paper will discuss the comprehensive solution adopted for converting the 3D digital/medical images directly into the computational model. The workflow using Simpleware Software – ScanIP and + ScanFE – will be illustrated including the option for directly exporting fully compatible models to COMSOL Multiphysics. The extra functionality that allows introduction, positioning and ...

Finite Element Modeling of Dielectric-Paraelectric Composite Materials

K. Zhou, S. Alpay, and S. Boggs
Institute of Material Science, University of Connecticut, Storrs, CT, USA

Finite Element analysis is used to model 2-D and 3-D paraelectric-dielectric composites (BaTiO3 spherical fillers randomly distributed in constant dielectric matrix). The effective dielectric response and tunability are studied under different filler sizes and different volume fractions. The results are consistent with previous theoretical and experimental results: with the increasing of filler ...

Validation of the Acoustic Finite Element Model of a Very Light Jet Cavity Mock-up

F. Teuma Tsafack, K. Kochan, T. Kletschkowski, and D. Sachau
Helmut Schmidt University/ University of the Federal Armed Forces Hamburg, Germany

This paper presents an important step in developing a combined active noise- and audio system for a light jet. To prepare its installation both a wooden mock-up and a finite element model of the investigated cavity were created. Sensitivity analysis and key parameters selection were done in order to validate the model. Error analysis between measured and computed data closes the ...

AC/DC Modeling and Experimental Impedance Verification of 3D MEMS Inductor Coils

T. Reissman, and E. Garcia
Sibley School of Mechanical and Aerospace Engineering, Cornell University, Ithaca, NY, USA

In this work, an analysis is presented for a 3-dimensional RF MEMS coil using the COMSOL AC/DC module in conjunction with the CAD import module. The realization of being able to produce such 3-dimensional RF coils allows for less surface area to be needed for similar inductor performance in comparison to larger planar RF coils by maintaining the same number of turns through super-positioning of ...

Numerical and Experimental Analysis of Natural and Mixed Convection Heat Transfer for Vertically Arranged DIMM

G. Petrone, and G. Cammarata
University of Catania, Catania, Italy

 It is commonly recognized that careful thermal design of electronic equipments represents an unavoidable pre-production step in order to ensure reliability and performance of those components during their functioning. This paper mainly concerns a comparison between experimental and numerical results obtained in studying thermal dissipation in natural and mixed convection conditions for RAM ...

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