Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

Efficient Generation of Surface Plasmon Polaritons with Asymmetric Nano-structures

J. Chen
Peking University
China

This paper covers the following: * All-Optical Light Modulation of surface plasmon polaritons (SPPs) is achieved using asymmetric single nanoslits. A high on/off switching ratio of >20 dB and phase variation of >? were observed with the device lateral dimension of only about 2 ?m. * Efficient unidirectional excitation of SPP as well as beam splitting are achieved using the dielectric–film ...

Shape, Convection and Convergence

R. Pryor
Pryor Knowledge Systems, Inc., Bloomfield Hills, MI, USA

COMSOL Multiphysics software, when properly configured, can readily solve modeling problems in the laminar flow regime using the standard Navier-Stokes equations or in the fully turbulent flow regime using the kappa-epsilon model. Failure to solve a particular model is typically manifested by instability in the calculation and a failure of the model to converge. This paper presents a new ...

Resonant Frequency Analysis of Quartz Shear Oscillator

T. Satyanarayana[1], V. Sai Pavan Rajesh[2]
[1]NPMASS Centre, Lakireddy Bali Reddy Autonomous Engineering College, Mylavaram, Andhra Pradesh, India
[2]Lakireddy Bali Reddy Autonomous Engineering College, Mylavaram, Andhra Pradesh, India

The most commonly used type of resonator is the AT-cut, where the quartz blank is in the form of a thin plate cut at an angle to the optic axis of the crystal. This paper reports the modeling of a quartz oscillator for a resonant frequency analysis based on piezoelectric effects. The proposed oscillator consists of a single quartz disc with two electrodes on the top and bottom surfaces of the ...

Thermomechanical Effects of the Packaging Molding Process on the Chip in Integrated Circuits - new

N. Semmar[1], M. Fournier[1], P. S. Alleaume [2], A. Seigneurin [3], , ,
[1]GREMI-UMR7344, CNRS/University of Orléans, Orléans, France
[2]Collegium Sciences et Techniques, Orléans, France
[3]ST Microelectronics Tours SAS, Tours, France

Usually, in integrated circuits, the chip is brazed on leadframe and then, a polymer resin is molded around to create the packaging. On the first hand, the molding process at high temperatures will induce thermomechanical stress on the chip. As the leadframe, the chip and the braze have all different thermoelastic properties, these stress can be critical for the chip connections. To ...

Experimentally Matched Finite Element Modeling of Thermally Actuated SOI MEMS Micro-Grippers Using COMSOL Multiphysics

M. Guvench[1], and J. Crosby[1]
[1]University of Southern Maine, Gorham, Maine, USA

In “Micro-Electro-Mechanical-Systems” shortly known as MEMS, one of the most important and effective principle of creating transduction of electrical power to displacement force is thermal expansion. A slim beam of MEMS material, typically Silicon, is heated by the application of electrical current via Joule heating; it expands and creates motion. In the design of many MEMS devices ...

Microfluidic Separation System for Magnetic Beads

F. Wittbrach, A. Weddemann, A. Auge, and A. Hütten
Department of Physics, Bielefeld University, Germany

It is possible to control the motion of magnetic beads using a combination of hydrodynamic and electromagnetic forces. In this work, we investigate the possibility to manipulate the motion of beads with different magnetic moments in a special microfluidic structure so as to separate them. We also experimentally prove that this structure is a suitable device to separate beads and show that the ...

Multi-Domain Analysis of Silicon Structures for MEMS Based-Sensors

N. Bhalla[1], S. Li[2], and D. Chung[1]
[1]Chung Yuan Christian University, Chungli,Taiwan
[2]National Tsing Hua University, Hsinchu, Taiwan

Investigation in this paper aims at performing Mechanical Stress Strain analysis, Thermal, Piezoresistive and Piezoeletric analysis of Silicon Structures using COMSOL. The simulation results have been cross checked by mathematical calculation.

Actively Controlled Ionic Current Gating In Nanopores

G. Zhang[1], S. Bearden[1]
[1]Clemson University, Clemson, SC, USA

It is necessary to understand and control nanopore behavior in order to develop biosensors for a variety of applications including DNA sequencing. The fluidics of nanopore devices we fabricated exhibits a range of interesting phenomena, such as enhanced conductance and current rectification. By electrically biasing nanopores, we were able to actively control the nanopore conductance in real time ...

Three-Dimensional Percolation Properties Simulation of a Marine Coating Based on Its Real Structure Obtained from Ptychographic X-Ray Tomography - new

B. Chen[1], M. Guizar-Sicairos[2], G. Xiong[1], L. Shemilt[1], A. Diaz[2], J. Nutter[1], N. Burdet[1], S. Huo[1], F. Vergeer[3], A. Burgess[4], I. Robinson[1]
[1]London Centre for Nanotechnology, University College London, London, UK
[2]Paul Scherrer Institute, Villigen, Switzerland
[3]AkzoNobel Co. Ltd., Sassenheim, Netherlands
[4]AkzoNobel (UK) Co. Ltd., Tyne and Wear, UK

We present quantitative nano-scale analysis of the 3D spatial structure of an anticorrosive aluminium epoxy barrier marine coating obtained by ptychographic X-ray computed tomography (PXCT) [1-3]. We then use COMSOL Multiphysics® software to perform simulations on the acquired real 3D structure to demonstrate how percolation through this actual 3D structure impedes ion diffusion in the ...

Expanding Your Materials Horizons

R. Pryor[1]
[1]Pryor Knowledge Systems, Inc. (COMSOL Certified Consultant), Bloomfield Hills, Michigan, USA

Materials and their related properties are intrinsically fundamental to the creation, development and solution of viable exploratory models when using numerical analysis software. In many cases, simply determining the location, availability and relative accuracy of the necessary material parameters for the physical behavior of even commonly employed design materials can be very difficult and ...