Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

Heat and Moisture Modeling Benchmarks using COMSOL

A. van Schijndel
Eindhoven University of Technology, Eindhoven, Netherlands

Benchmarks are an important tool to verify computational models. In the research area of building physics, the so-called HAMSTAD (Heat, Air and Moisture Standardization) project is a very well known benchmark for the testing of simulation tools. In this paper we evaluate the use of COMSOL with its multiphysics capabilities regarding this benchmark. In comparing the results with the benchmark, it ...

Simulation of Laser-Material Interactions for Dynamic Transmission Electron Microscopy Experiments

B.W. Reed[1], T.B. LaGrange[1], G.H. Campbell[1], and N.D. Browning[1,2]
[1]Lawrence Livermore National Laboratory, Livermore, CA, USA
[2]University of California Davis, Davis, CA, USA

The Dynamic Transmission Electron Microscope (DTEM) at Lawrence Livermore National Laboratory is a unique instrument able to capture images of fast-evolving microstructure with exposure times of only 15 ns. This is more than six orders of magnitude faster than conventional in situ electron microscopy and has enabled new insights into phase transformations, chemical reactions, and materials ...

Simulation and Verification of Coupled Heat and Moisture Modelling

N. Williams Portal[1], M. van Aarle[2], and J. van Schijndel[2]
[1]Department of Civil and Environmental Engineering, Chalmers University of Technology, SE-412 96 Göteborg, Sweden
[2]Department of Architecture, Building and Planning, Technical University of Eindhoven, Eindhoven, The Netherlands

This paper includes the implementation and comparison of two types of moisture potentials for the combined transport: the natural logarithmic of the suction pressure (LPc) and the relative humidity (RH). The finite element method has been utilized to evaluate coupled 1D thermal and hygric transport by means of COMSOL Multiphysics. The combined transport mechanisms were described by the ...

Coupling Heat Transfer in Heat Pipe Arrays with Subsurface Porous Media Flow for Long Time Predictions of Solar Rechargeable Geothermal Systems

P. Oberdorfer[1], R. Hu[1], M. Azizur Rahman[1], E. Holzbecher[1], M. Sauter[1], P. Pärisch[2]
[1]Applied Geology, Geoscience Centre, University of Göttingen, Göttingen, Germany
[2]Institute for Solar Energy Research Hameln/Emmerthal (ISFH), Emmerthal, Germany

An increased share of renewable energies is regarded as an integral part of a strategy towards a sustainable future. With regard to the heat supply sector this may be achieved using solar thermal collectors or heat pump systems with borehole heat exchangers. During the last years solar thermal and geothermal systems have generally been installed separately. Now, several proposals are discussed ...

Use of COMSOL as a Tool in the Design of an Inclined Multiple Borehole Heat Exchanger

E. Johansson[1], J. Acuña[1], B. Palm[1]
[1]Royal Institute of Technology KTH, Stockholm, Sweden

A field of connected boreholes can be used both for cooling, heating and storage purposes. The boreholes transfer heat to or from the ground, which over time changes the temperature in the ground. It is important that the borehole field is properly sized and evaluated before the construction. This study presents results from borehole field evaluations of inclined boreholes used for cooling ...

Simulation of Heat Transfer on Periodic Microstructured Surfaces for Evaporation Cooling

M. Hackert-Oschätzchen[1], R. Paul[1], M. Penzel[1], M. Zinecker[1], A. Schubert[1]
[1]Professorship Micromanufacturing Technology, Technische Universität Chemnitz, Chemnitz, Germany

Evaporative cooling is a promising cooling method for dissipating high heat fluxes in high power density applications. One possibility to enhance heat flux is a generation of microstructures into the cooler surface. This enlarges the cooler surface and systematically affects the fluid flow as well as the boiling process. In this study the geometric arrangement of cylindrical pin microstructures ...

Flow Analysis and Optimization of a Hierarchical Plate Heat Exchanger for an Adsorption Heat Pump

E. Tempfli[1], F.P. Schmidt[1]
[1]Karlsruhe Institute of Technology (KIT), Fluid Machinery (FSM), Karlsruhe, Germany

The paper investigates the hydrodynamic performance of a hierarchical parallel channel network for the objective of optimal thermal coupling to heat released in the adsorption processes, as in adsorption heat pumps. More specifically, the uniformity of the fluid flow over the network is improved by optimizing the topology of the manifold channels of the two hierarchical levels. For this purpose ...

Study of the Process, Design, and Operating Parameters Effect on the Efficiency of the Process Mill - new

A. K. Farouk[1]
[1]Department of Mathematics & Natural Science, University of Stavanger, Sandnes, Rogaland, Norway

This study is to investigate the velocity pattern and the velocity magnitude of the cuttings that is being processed in the process mill as a result of the rotating hammers. The process mill consists of a horizontal cylindrical shell equipped with renewable liners and rotating hammers for milling of drill cuttings. An F.E model of the process mill was constructed using dimensions similar to ...

Investigating the Performance of Mechanically Ventilated Double-Skin Facades with Solar Control Devices in the Main Cavity - new

C. G. Galante[1]
[1]Newtecnic Ltd, London, England, UK

The use of ventilated facades may reduce the cooling and heating energy demands of the building. Double-skin facades (DSFs) belong to the wider group of ventilated facades and currently represent one of the most interesting and studied facade systems. The purpose of this study is to investigate the thermal behaviour and performance of a DSF being designed for a real project in the Middle East ...

Thermal Simulation of FCBGA Package with Heat Sink

M. R. Naik[1]
[1]Nitte Meenakshi Institute of Technology, Bengaluru, Karnataka, India

In a modern IC design, the capability of predicting the temperature profile is critically important as well as cooling and related thermal problems are the principal challenges. To address these challenges, thermal analysis must be embedded within IC synthesis. This paper presents thermal analysis of the FCBGA chip with a 4mm×4mm×0.3mm silicon die. The silicon die dissipates heat flux of ...