The Application Gallery features COMSOL Multiphysics® tutorial and demo app files pertinent to the electrical, structural, acoustics, fluid, heat, and chemical disciplines. You can use these examples as a starting point for your own simulation work by downloading the tutorial model or demo app file and its accompanying instructions.
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When anodizing aluminum, the surface is electrochemically altered to form an abrasive and corrosion-resistive Al2O3 film. The electrode kinetics during the process are only marginally affected as the oxide layer grows, so a stationary analysis of the current distribution is sufficient to ... Read More
This model simulates the shape evolution of a microconnector bump over time as copper deposits on an electrode surface. Transport of cupric ions in the electrolyte occurs by convection and diffusion. The electrode kinetics are described by a concentration dependent Butler-Volmer ... Read More
This example shows how to model secondary current distribution and electrode growth with a moving geometry. To avoid numerical instabilities, a seed layer is introduced in the initial geometry to obtain a right angle at the edge between the growing electrode and the insulator. Read More
This example extends the analysis made in the model Electrodeposition on a Resistive Patterned Wafer by including the diffusion and convection of copper ions in the electrolyte. The coupled mass transport convection-diffusion effects are of interest in this type of reactor since they ... Read More
This model demonstrates the impact of convection and diffusion on the transport-limited electrodeposition of a copper microconnector bump (metal post). Microconnector bumps are used in various types of electronic applications for interconnecting components, for instance liquid crystal ... Read More
Electroless deposition or plating is a non-galvanic plating method that does not require any external electrical power. This technique is typically used for electroless plating of nickel, silver, gold and copper. In electroless deposition, partial oxidation and reduction reactions ... Read More
This example models electrocoating of paint onto a car door in a time-dependent simulation. The deposited paint is highly resistive which results in lowered local deposition rates for coated areas. A primary current distribution in combination with a film resistance model is used to ... Read More
This example models time-dependent copper deposition on a resistive wafer in a cupplater reactor. As the deposited layer builds up, the resistive losses of the deposited layer decreases. The benefit of using a current thief for a more uniform deposit is demonstrated. Read More
Rotating cylinder Hull cells are an important experimental tool in electroplating and electrodeposition and are used for the measurement of nonuniform current distribution, mass transport, and throwing power of plating baths. The model reproduces the results for a commercially available ... Read More