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Fountain Flow Effects on Electrodeposition on a Rotating Wafer

Application ID: 13865

This example extends the analysis made in the model Electrodeposition on a Resistive Patterned Wafer by including the diffusion and convection of copper ions in the electrolyte.

The coupled mass transport convection-diffusion effects are of interest in this type of reactor since they will be accentuated towards the rim of the wafer, limiting the current density. This will counter balance the activation overpotential which is highest at the rim due to electric current conduction effects in the wafer. By the design of the reactor, the relation between mass transport and activation potential effects can be optimized to make the current distribution over the wafer more uniform.

This model is included as an example in the following products:

Electrodeposition Module

The combination of COMSOL® products required to model your application depends on several factors and may include boundary conditions, material properties, physics interfaces, and part libraries. Particular functionality may be common to several products. To determine the right combination of products for your modeling needs, review the Specification Chart and make use of a free evaluation license. The COMSOL Sales and Support teams are available for answering any questions you may have regarding this.