Microresistor Beam

The example illustrates the ability to couple thermal, electrical, and structural analysis in the one model. This particular application displaces part of a beam by passing a current through it; the current generates heat, and the temperature increase leads to displacement through thermal expansion. The model estimates how much current and increase in temperature are necessary to displace the beam adequately.

COMSOL Multiphysics solves both the Conductive Media DC and Heat Transfer by Conduction application modes simultaneously and then, using the stored solution, it solves the Solid, Stress-Strain application mode.

Displacement in the structure due to thermal expansion