Technical Papers and Presentations

Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

Modeling of Anisotropic Laminated Magnetic Cores Using Homogenization Approaches

H. Neubert[1], J. Ziske[1], R. Disselnkötter[2]
[1]Technische Universität Dresden, Institute of Electromechanical and Electronic Design, Dresden, Germany
[2]ABB Corporate Research Center, Ladenburg, Germany

3D-modeling of magnetic components with FEM is challenging due to the involved nonlinearities and coupling effects between different physical domains. A specific issue is the consideration of lamination due to the high resulting element count for thin layers. Therefore, several homogenization approaches for laminated cores have been proposed which replace the laminated structure with a single ...

Influence of Air Gap Length and Cross-Section on Magnetic Circuit Parameters

A. Polit[1], R. Jez[1]
[1]ABB Corporate Research Center, Krakow, Poland

The air gap is one of the most crucial part of magnetic circuits, especially in high-power inductors. It significantly modifies the parameters of magnetic devices by increasing the saturation current, linearizing B-H curve of magnetic circuit and causing a decreasing in the inductance. Therefore the optimal selection of shape and dimensions of the air gap is very important from the design point ...

3D Multiphysics Model of Thermal Flow Sensors

C. Falco[1], A. De Luca[1], S. Sarfraz[1], F. Udrea[1]
[1]University of Cambridge, Cambridge, UK

The aim of this work is to present a model capable to describe the behaviour of a thermal flow sensor under every physical aspect. A generic thermal flow sensor relates the flow properties with a variation in the temperature profile inside the device itself. Thus, it is locally heated up with a resistive element biased with an external current, surrounded by one or more temperature sensing ...

Enhanced Surface Plasmon Polariton Propagation Induced by Active Dielectrics

M. Mattheakis[1], C. Athanasopoulos[1], G. P. Tsironis[1]
[1]University of Crete, Heraklion, Greece

We present numerical simulations for the propagation of surface plasmon polaritons in a dielectric-metal-dielectric waveguide using COMSOL Multiphysics® software. We show that the use of an active dielectric with gain that compensates metal absorption losses enhances substantially plasmon propagation. Furthermore, the introduction of the active material induces, for a specific gain value, a ...

Numerical Simulations of a Subsonic/Supersonic Coaxial Jet for an Efficient Design of Experimental Setup

D. Guariglia[1], C. Schram[1]
[1]von Karman Institute for Fluid Dynamics, Sint-Genesius-Rode, Belgium

The flow field of a coaxial jet with the internal (primary) flow being subsonic and the external (secondary) flow being supersonic has been investigated with COMSOL Multiphysics® software. We used the results to correct defects in the nozzle geometry and we evaluated the effect of heat transfer on the shock-cells system. Finally, we verified the stresses in the material to avoid permanent ...

Simulation and Experimental Validation of the Core Temperature Distribution of a Three-Phase Transformer

R. Barroso[1]
[1]Universidade Federal do Ceará, Fortaleza, Ceará, Brazil

This paper presents an application of COMSOL Multiphysics® software in the study of the temperature distribution of a 5kVA three-phase air-cooled transformer. A 3D, steady state model was utilized on the simulations. The interface with the surrounding air was modeled by Newton's Law of Cooling, discarding the need of solving the external air flow. The simulation agreed with the experimental ...

Activation Imaging of the Heart using Diffusion Models

R. Abou-Marie, and A. Jeremic
McMaster University, Canada

The inverse problem of electrocardiography involves determining information about the electrical activity of the heart from measurements on the body surface. The estimation of certain physiological parameters can potentially improve early detection of heart disease. In this study, we present an algorithm for estimating parameters that characterize the electrical activation. Estimation of ...

High-Performance Multiphysics Simulations

M. Ringh
COMSOL AB

In this presentation we present where COMSOL Multiphysics and its modules will be in the year 2007. The presentation considers the upcoming features, not only from a developers point of view, but also through examples from different branches of applied physics and mathematics. In addition, we present some important milestones during the past 10 years for COMSOL ...

Two-Dimensional Thermal Hydraulic Analysis and Benchmark in Support of HFIR LEU Conversion using COMSOL

J. D. Freels[1], I. T. Bodey[2], R. V. Arimilli[2], K. T. Lowe[3]
[1]: Oak Ridge National Laboratory
[2]: University of Tennessee, Knoxville, TN
[3]: Bettis Atomic Power Laboratory, West Mifflin, PA

The research documented herein was funded by a research contract between the Research Reactors Division (RRD) of Oak Ridge National Laboratory (ORNL) and the University of Tennessee, Knoxville (UTK) Mechanical, Aerospace and Biomedical Engineering Department (MABE). The research was governed by a statement of work (SOW) which clearly defines nine specific tasks. This report is outlined to ...

Electro-Thermo-Mechanical Finite Element Modeling to Investigate the Reliability of Automotive MOSFET Transistor

T. Azoui, P. Tounsi, and J.M. Dorkel
CNRS, LAAS, Toulouse, France

3D electro-thermo-mechanical finite element model of power vertical MOSFET used in the automotive industry is presented in this paper. The presented paper is a qualitative study of power device results from electro-thermo-mechanical simulation. This study particularly interested in the stress generated at the interface between the bonding wires and the source metallization to evaluate the ...

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