Capacitance Computation of Multilayered and Multiconductor Interconnects Using Finite Element Method

S. Musa, and M. Sadiku
College of Engineering, Prairie View A&M University, Prairie View, TX, USA
Published in 2008

The development and analysis of interconnects in inhomogeneous structures such as very large scale integration chips, printed circuit boards, and multichip modules are essential for next-generation electronic products.

In this paper, we illustrate fast and sufficiently accurate computation of capacitance matrices of multilayered and multiconductor interconnects applying the finite element method. We specifically design three-conductor transmission lines interconnect with three dielectric layers, and twelve-conductor transmission lines interconnect with five dielectric layers. Comparison of our numerical results from COMSOL Multiphysics with published data shows good agreement.

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